机械5

H/A镜座/马达贴附机落尘改善设计 摘要 H/A镜座/马达贴附机落尘问题一直是COB（Chip o
n board）芯片直接封装工艺上难以攻克之重点项目，如何管控好H/A镜座/马达贴附机落尘问题，直接关系到手机摄像头模组制造生产效率及产品最终品质。 通过对产品从芯片清洗后至封装前这一阶段particle（空气中尘埃）管控展开详细研究与论证，通过对落尘成分分析结果，排查分析制程中产生落尘之源头，阐述其采取多种防治对策以旨在降低H/A镜座/马达贴附机落尘比例。 首先，从两方面重点论述H/A镜座/马达贴附机落尘之来源：其一是从机台外部入手，针对上料时产品二次污染问题采取相应改善对策，力争产品在进入机台前保持清洁无污染；其二从机台内部入手，增加吹尘治具和防尘盖板，以保证产品刚进入机台时保持清洁无污染，并且在机台内部待料之时不会被二次污染。其次，通过对落尘成分分析结果，对比排查确认出机台内部多项产尘源头并一一加以改善，从而达到产品在机台内部不受污染之效果，最终实现降低Holder Bo
nd之后CCD下线落尘比例之目标。 关键词：封装工艺；落尘改善；吹尘治具；防尘盖板 Abstract The problem of falli
ng dust i
n the H/A mirror seat/ motor attachi
ng machi
ne is always the key project i
n the process of COB(Chip o
n board) chip direct packagi
ng. How to co
ntrol the problem of falli
ng dust from the H/A mirror seat/ motor attachi
ng machi
ne is directly related to the productio
n efficie
ncy a
nd the fi
nal product quality of the mobile camera module. Through the detailed research a
nd demo
nstratio
n of the particle(air dust) pipe co
ntrol i
n the phase of the product from the chip to the pre package, through the a
nalysis of the dust compositio
n, the source of the dust i
n the a
nalysis a
nd a
nalysis process is i
nvestigated, a
nd avariety of preve
ntio
n a
nd co
ntrol measures are adopted i
n order to reduce the falli
ng dust ratio of the H/A mirror seat/ motor attached machi
ne. First, from two aspects, the source of the falli
ng dust of the H/A mirror seat/ motor attachi
ng machi
ne is mai
nly discussed: first, from the outside of the machi
ne, the correspo
ndi
ng improveme
nt measures are take
n for the two pollutio
n problems of the product, a
nd the product is kept clea
nwithout pollutio
n before e
nteri
ng the machi
ne, a
nd the seco
nd is to i
ncrease the dust co
ntrol a
nd dust cover from the i
nside of the machi
ne. E
nsure that the product is clea
n a
nd pollutio
n-freewhe
n it e
nters the machi
ne, a
nd itwill
not be co
ntami
nated two timeswhe
n it is left i
nside the machi
ne. Seco
ndly, through the a
nalysis of the dust compositio
n a
nalysis results, a
number of sources of dust productio
n i
nside the machi
ne platform are co
nfirmed a
nd improved to achieve the effect that the product is
not polluted i
nside the machi
ne platform, a
nd the target of reduci
ng the falli
ng dust proportio
n of the CCD li
ne after the Holder Bo
nd is fi
nally realized. Keywords：Packagi
ng process; dust fall improveme
nt; dust blowi
ng fixture; dust-proof cover plate 目录 摘要I Abstract II 第1章绪论1 1.1 COB封装工艺1 1.2落尘改善方向2 1.2.1降低Particle来源2 1.2.2提高清洗良率2 1.3落尘改善方式3 第2章落尘来源研究4 2.1机台生产前落尘来源4 2.1.1空气流动4 2.1.2机台震动4 2.2机台画胶后落尘的来源5 2.3机台Holder Bo
nd之后落尘的来源5 2.3.1等待工位切换时产生落尘5 2.3.2运动部件线路及气管运动5 第3章落尘改善设计6 3.1对机台生产前落尘改善6 3.1.1镂空式料盒盖地导入6 3.1.2自动翻板机地导入7 3.3对机台画胶后落尘改善10 3.3.1入料口增加吹尘治具11 3.3.2画胶工位待料处增加防尘盖板11 3.3.3更改画胶高度与路径12 3.4对机台Bo
nd后落尘改善13 3.4.1 Bo
nd工位待料处增加防尘盖板13 3.4.2运动部件线路与气路的处理13 3.4.3转盘的改造14 3.5待料处防尘盖板说明15 第4章吹尘治具的设计17 4.1吹尘治具的用途17 4.2初代吹尘治具的设计思路17 4.1.1定位精度的实现18 4.1.2吹尘力度的计算18 4.1.3吸尘效率20 4.1.4吹尘时间控制的实现20 4.1.5吹尘治具的工作原理20 4.1.6压缩气体的干燥与洁净保证21 4.2新型吹尘治具的设计22 4.2.1改造背景22 4.2.2改造方向22 4.2.3一排式吹尘治具23 第5章改善效果24 5.1进料口改善效果24 5.1.1镂空式料盒盖引进效果24 5.1.2自动翻板机效果24 5.1.3吹尘治具效果25 5.2其他改善效果26 5.2.1防尘盖板效果26 5.2.2转盘改善效果26 结论28 参考文献29 致谢30